Packaging
Automatic Dicing Saw - DAD3221
- Accuracy in x/y: 5 µm
- Accuracy in z: 1 µm
- Substrate thickness < 12 mm
- Materials: Si, GaAs, SOS (Silicon on Sapphire), ...
Contact: Adrian Abazi
Location: CeNTech II, 2.03
Wire bonder - tpt HB10
- Wedge and ball bonding
- Motorized z-axis
- Bond arm length 165 mm
- Al and Au wires of 25µm diameter
- Laser assisted XY positioning system
- Substrate heating
- Digital live imaging
- Pull tester
Contact: Maik Stappers
Location: CeNTech II, electronic lab, room 2.16b