Plasma Etching
Reactive Ion Etcher (RIE) - Oxford PlasmaPro 80
- Open load design allows fast wafer loading and unloading
- Up to 200mm wafers
- Processes: SiN, NbN, Si, ...
Contact: Adrian Abazi, Maik Stappers
Location: SoN, plasma zone
Inductively Coupled Reactive Ion Etcher (ICP RIE) - Oxford PlasmaPro 100
- Up to 200mm wafers
- Process gases: Ar, O2, SF6, CF4, CHF3, HBr, Cl2, BCl3
Contact: Maik Stappers
Location: SoN, plasma zone
Plasma Asher- Diener Zepto-W6
- Power: 0 – 200 W continuous control
- Frequency: 13.56 MHz
- O2 plasma
- Plasma process for cleaning chip surfaces and stripping the residual of E-beam resist
- PC control with operating system Microsoft Windows
- Recipe editable via the touch sensitive screen with the provided pen
Contact: Lin Jin, Anna Ovvyan, Mostafa Amirpour
Location: CeNTech I, plasma zone
Wet Etching
Acid wet bench- Arias
- General processes with acids (excluding HF)
- Piece part samples, manual processes
Contact: Riya Gupta, Mostafa Amirpour
Location: SoN, inorganic chemistry zone
Base wet bench- Arias
- KOH chemistry
- Silicon anisotropic wet etching
- Piece part samples, manual processes
Contact: Riya Gupta, Mostafa Amirpour
Location: SoN, inorganic chemistry zone
HF wet bench
- HF etching capabilities (BOE 7:1) in a dedicated HF area
- Piranha etch (4:1 H2SO4:H202)
Contact: Lin Jin
Access strictly restricted to authorized users.
Location: CeNTech II, 2.03